Sunday, June 19, 2016

MecSoft Launches MILL-Xpress Configuration

IRVINE, CA, USA, Jun 19, 2016 - MecSoft Corporation, the developer of industry leading CAD/CAM software solutions, has announced the launch of a new configuration to the Milling module of its popular CAM software product line, called Xpress. This configuration is tailored for the growing community of makers, tinkerers, and DIY’ers who are looking for an easy to use, inexpensive but powerful software solution for programming CNC mills.

MILL-Xpress will be available for VisualCAD/CAM, RhinoCAM and VisualCAM for SOLIDWORKS.

Features of this configuration include:
  • 2½ Axis methods such as Facing, Pocketing, Profiling, and Drilling
  • 3 Axis methods such as Z-level roughing and Parallel Finishing
  • Standard tools such as Ball, Flat, Corner Radius, V and Drill tools
  • Free post processors
  • Ability to step up to more advanced configurations as the need arises
The launch of MecSoft’s MILL-Xpress configuration will give the growing community of makers a very capable and inexpensive solution to enable them in their pursuit of learning and utilizing CNC technology. Even though our products are currently being used by many in this movement, we feel that with the launch of this configuration, we are making it even easier for makers to participate in the utilization of advanced CNC technology, stated Joe Anand, President of MecSoft Corporation.

About MecSoft

Headquartered in Irvine, California, MecSoft Corporation is a worldwide leader in providing Computer Aided Manufacturing (CAM) software solutions, addressing both Additive and Subtractive manufacturing technologies, for the small to mid-market segments. These solutions include products VisualCAD/CAM/3DPRINT, VisualCAM for SOLIDWORKS and RhinoCAM & Rhino3DPRINT. These software products deliver powerful, easy-to-use and affordable solutions for users in the custom manufacturing, rapid prototyping, rapid tooling, mold making, aerospace, automotive, tool & die, woodworking, and education industries. For more information, visit or call (949) 654-8163.

3D Systems Names John McMullen as Executive VP, CFO

ROCK HILL, SC, USA, Jun 19, 2016 - 3D Systems (NYSE:DDD) announced that John N. McMullen will join the company as Executive Vice President and Chief Financial Officer, effective July 1, 2016. Elected by the Board of Directors and reporting to President & CEO Vyomesh Joshi, McMullen succeeds David Styka in the CFO role. Styka will remain with the company to provide operational and financial support to Management.

McMullen brings to 3D Systems over three decades of progressive finance leadership experience, most recently serving as Executive Vice President and Chief Financial Officer of Kodak (NYSE: KODK). Before that, McMullen led a successful 32-year career at HP and its acquired companies, Compaq Computer and Digital Equipment Corporation. His positions included Senior Vice President of Finance and Corporate Treasurer of HP, Chief Financial Officer of HP’s Imaging and Printing Group, and Vice President of Finance and Strategy for Compaq’s Worldwide Sales and Services Group. Since 2011, McMullen has served on the Board of Directors and as Audit Committee Chair of Vocera Communications.

“We are excited to have a leader of John’s caliber join our team,” commented Vyomesh Joshi (VJ), President & CEO, 3D Systems. “John’s demonstrated ability to deliver an appropriate cost structure, scalable processes and an effective business model at global technology companies can help us drive transformation and profitable growth. I am deeply grateful for Dave’s many contributions to the company and am pleased that he will continue to lend his expertise as part of our evolving team.”

“It is a tremendous opportunity to be part of 3D Systems at such a pivotal time for the company and the 3D printing industry,” commented McMullen. “Based on our successful and productive history, it is a privilege to work alongside VJ once again.”

About 3D Systems

3D Systems provides comprehensive 3D products and services, including 3D printers, print materials, on-demand manufacturing services and digital design tools. Its ecosystem supports advanced applications from the product design shop to the factory floor to the operating room. 3D Systems’ precision healthcare capabilities include simulation, Virtual Surgical Planning, and printing of medical and dental devices as well as patient-specific surgical instruments. As the originator of 3D printing and a shaper of future 3D solutions, 3D Systems has spent its 30 year history enabling professionals and companies to optimize their designs, transform their workflows, bring innovative products to market and drive new business models. For more information, visit

Nowy Styl Group Selects Dassault My Product Portfolio

V√ČLIZY-VILLACOUBLAY, France and KROSNO, Poland, Jun 19, 2016 - Dassault Systems (Euronext Paris: #13065, DSY.PA), the 3DEXPERIENCE Company, world leader in 3D design software, 3D Digital Mock Up and Product Lifecycle Management (PLM) solutions, announced that Nowy Styl Group, a European leader in comprehensive furniture solutions and the third largest manufacturer of office furniture in Europe, has selected the “My Product Portfolio” industry solution experience to design, develop and deliver more innovative products and accelerate new product introductions. 

Nowy Styl Group’s six brands, offices in 17 countries and network of designers and suppliers furnish customers in 100 countries, introducing forward-thinking product development and manufacturing methods such as chair components made from recycled plastic or thermal energy produced from wood waste. Workstations, conference spaces, reception areas, hotels, restaurants, cinemas, stadiums and auditoriums all seek durable, reliable and ergonomic furniture installations that are esthetically pleasing and contribute to the end-user experience in each environment. 

Based on Dassault Systems’ 3DEXPERIENCE platform, the “My Product Portfolio” industry solution experience provides a unified, digital environment to support and improve complex global product development processes related to prototyping, product configuration, design, market studies and multi-disciplinary collaboration. It also brings collaborative innovation to address data and processes for engineered products. Nowy Styl Group can implement design-for-cost strategies and launch products faster and in compliance with sustainability targets and safety norms. It can test and validate designs and simulate products in a virtual environment. Nowy Styl Group can ensure manufacturability early on, as well as leverage 3D representations of products and collaborative applications to communicate both internally and with clients.

“Each of our customers has specific needs requiring individual analysis, space planning and customized production and we pride ourselves on concepts that balance design and engineering,” said Tomasz Bardzik, CTO, Nowy Styl Group. “Dassault Systems’ industry solution experience helps our technical departments, personnel, partners and suppliers better communicate and monitor and detect issues early in the development process to optimize product quality. These capabilities reduce development and manufacturing time and costs and improve our time to market.”

“Innovative and dynamic hard goods companies like Nowy Styl Group can benefit from intuitive technology environments that offer a new experience in collaborative innovation for engineered products,” said Susan Olivier, Vice President, Consumer Goods and Retail Industry, Dassault Systems. “‘My Product Portfolio’ brings mechanical engineering, enterprise collaboration, production configuration and program management applications to imagine, design and deliver the right products to their customers.”

For more information on Dassault Systems’ industry solution experiences for Consumer Goods & Retail, visit

About Dassault Systems

Dassault Systems, the 3DEXPERIENCE Company, provides business and people with virtual universes to imagine sustainable innovations. Its world-leading solutions transform the way products are designed, produced, and supported. Dassault Systems’ collaborative solutions foster social innovation, expanding possibilities for the virtual world to improve the real world. The group brings value to over 210, 000 customers of all sizes, in all industries, in more than 140 countries. For more information, visit

MSC Nastran, Patran 2016 for CAE Released

NEWPORT BEACH, CA, USA, Jun 19, 2016 - MSC Software Corporation announced new releases of MSC Nastran and Patran. MSC Nastran 2016 delivers dramatic performance and speed improvements as well as new multidisciplinary analysis solutions. Patran 2016 improves support for nonlinear and fatigue analysis capabilities.

Release highlights of MSC Nastran:

  • MSC Nastran 2016 uses enhanced Automated Component Mode Synthesis (ACMS) method with Shared Memory Parallel (SMP) computing delivering better performance and ability to effectively use more cores for higher user productivity. 50% parallel efficiency has been observed for 16 processors. SMP Parallelization can now be used to reduce the overall wall time stiffness matrix computations and stress recovery. 75% parallel efficiency has been achieved with 4 threads with the job running 3 times faster than with one processor.
  • Availability of Intel MKL Pardiso solver has been extended to provide better scalability, thereby lowering the overall elapsed time of simulations.
3D Rotor Dynamics
  • With the new 3D modelling capability, users can now model discrete blades and non-symmetric components of rotors and stators of rotating machinery, turbines and jet engines improving the accuracy of the rotor dynamic analyses. This type of modelling was not possible with 1D or 2.5D modelling solutions. With 3D modelling, engineers can now see what is happening locally at each blade or at the component level.
Dynamics and NVH
  • Equivalent Radiated Power (ERP) can now be output for higher order shell and solid elements. It is also possible to output velocity normal to the surface and vibration intensity.
  • Multiple load vectors produced by Actran can now be selectively incorporated in MSC Nastran's frequency response analysis.
  • Efficiency of large poroelastic material simulations is improved with access to out-of-core solver of Actran.
  • New in this release is Global Optimization (GO) which combines automatic multi-start global methods and gradient based local optimization methods. This approach searches the complete design space for the best possible solutions. The new capability was implemented to help automotive and aerospace companies to lightweight safely while optimizing their designs.
  • Multi-model optimization (MMO) provides the ability to process separate design models with different topology or analyses to perform combined optimization. This capability is enhanced to solve larger problems and without limit on the number of models.
MSC Nastran Embedded Fatigue
  • To maintain consistency with other fatigue solvers, nodal averaged stresses and strains are used for faster computation speed and a more realistic fatigue damage factors.
  • Skinning is implemented to create a 2D stress state on the surface of the model leading to fewer calculation points and enabling multi-axial assessments and correction on 3D solid elements.
Advanced Nonlinear
  • Beam contact is implemented with segment-to-segment contact algorithm and support for general beam cross section, tube-in-tube contact, including beam offsets, reducing computational cost and providing better accuracy.
  • Interference fit analysis common to engineering applications is enhanced to handle large interferences/overlaps.
Explicit Analysis
  • Three new models have been introduced to simulate complex material behaviour, namely, a time dependent viscoelastic creep model, Thermo-elasto-viscous plastic creep model, and Riedel-Hiermaier-Thoma model for concrete materials.
  • Adaptive solid elements that transform to SPH particles which can help simulate the effects of debris after element failure
  • In addition to the existing result formats, MSC Nastran 2016 introduces a new results database based upon the HDF5 standard, which is an open format that will allows easier access via public viewers, Python, Java or C++.
  • A new utility is available to provide output file data in easier to read format.
For more information about the new releases, watch the on-demand new release webinar at
About MSC Software

MSC Software is one of the ten original software companies and a global leader in helping product manufacturers to advance their engineering methods with simulation software and services. As a trusted partner, MSC Software helps companies improve quality, save time, and reduce costs associated with design and test of manufactured products. Academic institutions, researchers, and students employ MSC's technology to expand individual knowledge as well as expand the horizon of simulation. MSC Software employs 1,200 professionals in 20 countries. For more information about MSC Software's products and services, visit

Chaos Group Releases V-Ray 3.4 for 3ds Max, Maya

SOFIA, Bulgaria, Jun 19, 2016 - Chaos Group releases V-Ray 3.4 for 3ds Max and Maya. Free updates are now available for V-Ray 3.x for 3ds Max and V-Ray 3.x for Maya customers. 

V-Ray 3.4 introduces CPU and GPU-accelerated de-noising. Now you can automatically remove noise and cut render times by up to 50%.

V-Ray 3.4 for 3ds Max
V-Ray 3.4 for Maya

Saturday, June 18, 2016

COMSOL Multiphysics, Server v5.2a for CAE Released

BURLINGTON, MA, USA, Jun 18, 2016 - COMSOL, Inc. the leading provider of multiphysics modelling, simulation, and application design software, announced the latest release of the COMSOL Multiphysics and COMSOL Server simulation software environment. Hundreds of user-driven features and enhancements to COMSOL Multiphysics, COMSOL Server, and add-on products have been implemented with an emphasis on accuracy, usability, and productivity. From new solvers and methods, to application design and deployment tools, COMSOL software version 5.2a expands the electrical, mechanical, fluid, and chemical design and optimization capabilities.

Powerful New Tools for Multiphysics Simulation

In COMSOL Multiphysics 5.2a, three new solvers deliver faster and more memory efficient computations. The smoothed aggregation algebraic multi-grid (SA-AMG) solver has proven to be particularly efficient for linear elastic analysis, but is also applicable to many other types of analyses. This solver is very memory conservative, making it possible to run structural assemblies with millions of degrees of freedom on a standard desktop or laptop computer.

Thermoviscous acoustics simulation solved with the domain decomposition solver. Local acceleration, total acoustic pressure, and total thermo-viscous power dissipation density are shown. This COMSOL model is used to design microphones and speakers used in consumer products, such as, smartphones, tablets, and laptops. It consists of 2.5 million degrees of freedom and required 14 GB of RAM to solve. Previsously 120 GB were needed using a direct solver.

The domain decomposition solver has been optimized for handling large multiphysics models. “The domain decomposition solver provides simulation specialists with a robust and flexible technology to more efficiently compute strongly-coupled multiphysics applications which previously required a memory-hungry direct solver,” says Jacob Ystrom, Technical Manager of the numerical analysis department at COMSOL. “Using this solver, customers will benefit from improved efficiency when running on single computers, clusters, as well as when combined with other solvers such as the aggregation algebraic multigrid solver.”

A new explicit solver based on the discontinuous Galerkin (DG) method for acoustics in the time-domain is now available. “Combing the discontinuous Galerkin method with the new absorbing layers in the time-domain, results in a level of memory efficiency that will allow our customers to perform more realistic simulations than ever possible before, for a given memory size” says Mads Jensen, Technical Product Manager, Acoustics.

Building and Deploying Apps: Easy and Scalable for Global Use

The complete suite of computational tools provided by COMSOL Multiphysics software and its Application Builder allows simulation specialists to design and optimize their products and create apps for the benefit of colleagues and customers. Simulation apps allow users without any previous experience using simulation software to run the apps for their specific purpose. With version 5.2a, app designers can build even more dynamic apps where the appearance of the user interface can change during run time, centralize unit handling to better serve teams working across different countries, and include hyperlinks and videos.

This app example shipped with the Application Libraries included in COMSOL Multiphysics and COMSOL Server, can be used for the design of a magnetic induction device used for food processing.

Apps can be deployed throughout organizations using the COMSOL Client for Windows or web browser by connecting to a COMSOL Server installation. This provides a cost-effective solution for managing how apps are used, either by users within an organization or to an organization’s clients and customers worldwide. In this latest version, administrators can customize the visual appearance and style of COMSOL Server software for branding purposes, and set the number of pre-launched applications for high-usage cases.

“By providing our customers with the flexibility to customize the visual appearance and style of their COMSOL Server installation, they will be able to provide a cohesive brand experience that their colleagues and customers will be able to easily recognize and adopt into their existing processes,” says Svante Littmarck, President and CEO, COMSOL Inc. 

“The Application Builder allowed us to give other departments access to our analysis app without them needing to learn finite element theory,” commented Romain Haettel, Principal Engineer of ABB Corporate Research Center (ABB CRC). “We have also been using the COMSOL Server license to distribute our app to colleagues worldwide for testing. With this new version we can hopefully bring an even better user experience through quick launch from our own styled version of the COMSOL Server software.” ABB is a global leader in manufacturing of power transformers and innovator in creating and deploying simulation apps for worldwide use. “Our customers have come to trust the exceptional robustness and user-friendliness of our multiphysics solutions for app creation and deployment. They’re reaping the benefits of such technology by implementing more efficient workflows and processes,” concludes Littmarck.

Hundreds of User-Driven Features and Enhancements to COMSOL Multiphysics, COMSOL Server, and Add-On Products

Administrators can customize the visual theme of the COMSOL Server web interface. Colors, logos, and log in screen can be customized and HTML code added for branding purposes.

Version 5.2a delivers user-driven, new and enhanced functionality from core technology to specialized boundary conditions and material libraries. For example, the tetrahedral meshing algorithm with an included state-of-the-art quality optimization algorithm has made it easier than ever to create coarse meshes used for the preliminary study of complicated CAD geometries that feature many thin parts. Visualizations now include annotations with LaTeX formatting, improved table surface plots, VTK export, and new color tables. 

Magnetic vector hysteresis for the modelling of transformers and ferromagnetic material is introduced. Domain terminal boundary conditions for easier simulation of touch screens and MEMS devices are now available. Ray tracing simulations can combine graded index and constant index materials in meshed and unmeshed domains. The new Optical Aberration plot type is dedicated to measuring monochromatic aberrations. Two-port-networks, fast-frequency sweeps, and non-linear frequency-mixing are available for high-frequency electromagnetics analysis.

COMSOL numerical simulation of a wetted transient time-of-flight ultrasound flow meter. Ultrasound signal propagating in the device is shown at different time steps. The steady-state background flow in the flow meter is computed first. The Convected Wave Equation, Time Explicit physics interface is then used to model the ultrasound signal propagating in the device. The interface is based on the discontinuous Galerkin method (DG).

Design and manufacturing engineers working across all industries will benefit from the new adhesion and de-cohesion feature as they analyse various processes involving mechanical contact with parts sticking together and pulling apart. A new physics interface for modelling linear and non-linear magnetostriction is also available. Heat transfer users can now access a meteorological database from 6000 weather stations and model fluid, solid, or porous media thin structures.

Users modelling fluid flow with buoyancy will appreciate the new gravity property for density variations, which simplifies the set up of natural convection applications where density may vary depending on temperature, salinity, or other variables. Pipe flow simulations can now benefit from the advanced pump curves. For chemical simulations, surface reaction in reactive pellet beds and a new reacting flow multiphysics interface are available. Battery manufacturers and designers can now model complex 3D assemblies in battery packs using the new single particle battery interface. Discharge and recharge behaviours are supplied by the single particle model at every point in the geometry. This makes it possible to estimate the geometrical current density distribution and the local state of charge in the battery pack.

Highlights of New Features and Tools Available in Version 5.2a
  • COMSOL Multiphysics, Application Builder, and COMSOL Server: The appearance of the user interface of simulation apps can change during run time. Centralized unit handling to better serve teams working across different countries is supported. Hyperlinks and videos can now be included. A new Add Multiphysics window makes it easier for users to create multiphysics models incrementally by providing a list of available predefined multiphysics couplings for the selected physics interfaces. Autocomplete has been expanded to many fields including the equation view fields.
  • Geometry and Mesh: The enhanced tetrahedral meshing algorithm can now easily create coarse meshes for complicated CAD geometries that feature many thin parts. A new optimization algorithm built into the mesher is available for improving element quality, which may improve the accuracy of a solution and make it faster to converge. Interactive drawing for 2D geometries now features better coordinate display and snapping points.
  • Mathematical Modelling Tools, Studies, and Visualization: Three new solvers are introduced: the smoothed aggregation algebraic multigrid method (SA-AMG), the domain decomposition solver, and the discontinuous Galerkin (DG) method. Users can now save data and plots added to the Export node under Results in VTK format, making it possible to import COMSOL simulation results and meshes to 3rd party software.
  • Electrical: The AC/DC Module now features a material model for magnetic hysteresis built-in called Jiles-Atherton. The new lumped two-port network coupling is introduced in the RF Module, allowing for lumped modelling to represent parts of a microwave circuit in a simplified way without having to model the details.
  • Mechanical: The Structural Mechanics Module includes the new adhesion and de-cohesion features, available as a subnode under the Contact feature. A Magnetostriction physics interface that supports both linear and nonlinear magnetostriction is now available. The nonlinear material modelling capabilities have been expanded with new plasticity models, mixed isotropic and kinematic hardening, and large-strain viscoelasticity.
  • Fluid: The CFD Module and Heat Transfer Module now include a feature that adds a gravity force and concurrently compensates for the hydrostatic pressure on boundaries. A new linearized density option in Non-Isothermal Flow, a common simplification for natural convection flows, is now available.
  • Chemical: Battery manufacturers and designers can now model complex 3D assemblies in battery packs using the Single Particle Battery physic interface available in the Batteries & Fuel Cells Module. Additionally, a new Reacting Flow Multiphysics physics interface is now available.
Using COMSOL Multiphysics, Application Builder, and COMSOL Server, simulation specialists have access to a fully integrated software environment to create applications that will best serve their specific industry in a dynamic, easy to use, quick to implement format that can be scaled for global benefit.


To watch the release highlights video and download COMSOL Multiphysics and COMSOL Server software version 5.2a , visit


COMSOL is a global provider of simulation software for product design and research to technical enterprises, research labs, and universities. Its COMSOL Multiphysics product is an integrated software environment for creating physics-based models and simulation apps. A particular strength is its ability to account for coupled or multiphysics phenomena. Add-on products expand the simulation platform for electrical, mechanical, fluid flow, and chemical applications. Interfacing tools enable the integration of COMSOL Multiphysics simulations with all major technical computing and CAD tools on the CAE market. Simulation experts rely on the COMSOL Server product to deploy apps to their design teams, manufacturing departments, test laboratories, and customers throughout the world. Founded in 1986, COMSOL employs more than 400 people in 22 offices worldwide and extends its reach with a network of distributors. For more information, visit

Wednesday, May 25, 2016

COMSOL Announces Simulation Apps Support of 5G, IoT

BURLINGTON, MA, USA, May 25, 2016 - COMSOL, the leading provider of multiphysics modelling, simulation, and application design software, has announced support for app development that furthers work toward 5G and the IoT. Several of these application examples will be introduced at the International Microwave Symposium (IMS) 2016. The COMSOL Multiphysics software and its Application Builder provides simulation experts with the tools needed to turn their detailed physics and mathematical models into easy-to-use simulation apps for use by everyone in their organization and beyond. “We wanted to show designers how easy it is to build a customized easy-to-use interface based on their detailed model in order to let anyone in product development test different operating conditions and configurations,” said Jiyoun Munn, technical product manager of the RF Module at COMSOL.

This app created with COMSOL Multiphysics, simulates a single slot-coupled microstrip patch antenna fabricated on a multilayered low temperature co-fired ceramic (LTCC) substrate. Users may control inputs such as properties of a single antenna and array geometry. Results show the far-field radiation pattern of the antenna array and its directivity.

This app created with COMSOL Multiphysics, simulates a single slot-coupled microstrip patch antenna fabricated on a multilayered low temperature co-fired ceramic (LTCC) substrate. Users may control inputs such as properties of a single antenna and array geometry. Results show the far-field radiation pattern of the antenna array and its directivity.

As we work toward 5G and the Internet of Things (IoT), designers of RF and microwave devices will benefit from multiphysics modelling and simulation of antennas and circuits, not limited to RF and microwaves but extending to the range of millimetre waves and Terahertz. The latest release of the RF Module in COMSOL Multiphysics comes with several application examples that allow COMSOL software users to run, inspect, and use the apps – allowing them to see how straightforward it is to turn their model into a custom application.

Of interest to antenna designers is the Slot-Coupled Microstrip Patch Antenna Array Synthesizer demo app, pictured here. It simulates an FEM model of a device that is fabricated on a multilayered low temperature co-fired ceramic (LTCC) substrate, and extends the results to the user-specified array configuration.

The results include S-parameter, electric field distribution on each layer, far-field radiation pattern of the antenna array, and its directivity. The far-field radiation pattern is calculated by multiplying the array factor and the single antenna radiation pattern to perform an efficient far-field analysis without simulating a complicated full array model, allowing the app user to independently obtain their simulation results within seconds. “Given how competitive the race is to deliver the best 5G solutions, building simulation apps for an entire team will allow designers to share their expertise easily and free up resources to develop new concepts,” adds Munn.

Using COMSOL Multiphysics, microwave and RF designers can couple electromagnetic simulations with heat transfer, structural mechanics, fluid flow, and other physical phenomena, allowing them to represent coupled physics effects as they would occur in the real world. That means being able to accurately investigate designs and fully benefit from the virtual prototyping capabilities COMSOL offers.

The upcoming version of the RF Module, which is scheduled to be released shortly after the International Microwave Symposium (IMS) 2016, strengthens its design and test feasibility by including new tutorial models such as a log-periodic antenna for EMI/EMC Testing, and a signal integrity (SI) and time-domain reflectometry (TDR) analysis of adjacent microstrip lines. The Application Libraries also include detailed model examples guiding users to perform very fast prototyping with high accuracy through reduced-order model simulation techniques based on asymptotic waveform evaluation (AWE) and frequency-domain modal methods.


COMSOL is a global provider of simulation software for product design and research to technical enterprises, research labs, and universities. Its COMSOL Multiphysics product is an integrated software environment for creating physics-based models and simulation apps. A particular strength is its ability to account for coupled or multiphysics phenomena. Add-on products expand the simulation platform for electrical, mechanical, fluid flow, and chemical applications. Interfacing tools enable the integration of COMSOL Multiphysics simulations with all major technical computing and CAD tools on the CAE market. Simulation experts rely on the COMSOL Server product to deploy apps to their design teams, manufacturing departments, test laboratories, and customers throughout the world. Founded in 1986, COMSOL employs more than 400 people in 22 offices worldwide and extends its reach with a network of distributors. For more information, visit

Wednesday, May 18, 2016

Stratasys to Offer Universal Design-to-3D Print Software with GrabCAD Print

MINNEAPOLIS, MN, USA and REHOVOT, Israel, May 18, 2016 - Stratasys Ltd. (Nasdaq:SSYS), the 3D printing and additive manufacturing solutions company, unveiled a bold, new software strategy designed to make 3D printing significantly easier, more intuitive and highly accessible. The approach is powered by a new, open architecture "design-to-3D print" workflow application, GrabCAD Print* - residing on the popular GrabCAD SaaS platform and supported by a community of more than 3 million designers, engineers and students.

Unified Platform for Job Preparation, Scheduling and Monitoring

3D printing techniques are typically characterized by significant "model fixing" time which forces businesses to devise costly, manual solutions to construct an acceptable workflow. GrabCAD Print is designed to make 3D printing fast and easy-to-use, while reducing errors by eliminating requirements to translate and repair computer-aided design (CAD) files. Product designers, engineers, and 3D printer operators can now send native CAD files to Stratasys 3D Printer or service bureau directly from their familiar CAD environments. Further bolstered by an extensive new business intelligence environment, the application also accelerates data-driven decision-making.

"When we acquired GrabCAD two years ago, our vision was to provide a digital manufacturing backbone to support adoption of 3D printing technologies," said Josh Claman, Chief Business Officer, Stratasys. "Underscoring the critical nature of software as an essential ingredient for complete and smooth 3D printing workflow, GrabCAD Print is our first new application built on the GrabCAD platform - empowering customers with a single, open, cloud-based environment for job preparation, scheduling and monitoring. Accelerating integration of additive manufacturing on the shop floor, GrabCAD Print also generates real-time business intelligence which can be prepared in actionable reports for Stratasys 3D Printers on the user's GrabCAD Print network."

The GrabCAD Print solution’s easy-to-use and intuitive print preparation environment removes typical complexities from the design-to-3D print process.

An Open Environment for 3D Printing Expansion

GrabCAD Print works with a variety of Stratasys FDM and PolyJet 3D Printers and can natively read several popular CAD formats from PTC Creo, Dassault Systems' SOLIDWORKS, Siemens PLM Software's NX software, CATIA and Autodesk Inventor. The application also facilitates data sharing related to job scheduling, print queue status, material usage and historical usage. All information is readily available via standard Web browsers, mobile applications or locally installed clients while securely managed through the GrabCAD Platform.

New GrabCAD Print simplifies the 3D printing process with an intuitive, streamlined workflow that includes actionable business intelligence.

Committed to architecting an open and partner-friendly solution, Stratasys is making full use of a powerful 3D design ecosystem - creating additional value-added applications based on the GrabCAD Platform. Industry leading CAD solution providers such as PTC, Dassault Systems' SOLIDWORKS, and Siemens PLM Software will be collaborating with Stratasys to further simplify key functions in CAD-to-3D print workflow. Users of these offerings will be able to access Stratasys 3D printing solutions, analyse designs for 3D printability, and prepare and print jobs from their native CAD environment.

"When keeping up with fast paced development, frequently things will change in the last minute. In the past when a build had to be switched to a different 3D printer I'd have to do a clean restart - redo all of that file preparation work. With GrabCAD Print it's easy to switch between 3D printers within a single app. That's a huge step forward in improving the workflow," said Jimmy Callaway, Design Engineer, Joe Gibbs Racing.

*The GrabCAD Print application is planned for public beta in North America this summer with additional releases planned throughout the year alongside new language and regional support.

For more information, visit

About Stratasys Ltd.

For more than 25 years, Stratasys Ltd. (NASDAQ:SSYS) has been a defining force and dominant player in 3D printing and additive manufacturing - shaping the way things are made. Headquartered in Minneapolis, Minnesota and Rehovot, Israel, the company empowers customers across a broad range of vertical markets by enabling new paradigms for design and manufacturing. The company's solutions provide customers with unmatched design freedom and manufacturing flexibility - reducing time-to-market and lowering development costs, while improving designs and communications. 

Stratasys subsidiaries include MakerBot and SolidScape, and the Stratasys ecosystem includes 3D printers for prototyping and production; a wide range of 3D printing materials; parts on-demand via Stratasys Direct Manufacturing; strategic consulting and professional services; the GrabCAD platform with over 3 million professional users; and the Thingiverse and GrabCAD communities with over 2 million 3D printable files for free designs. With more than 2,700 employees and 800 granted or pending additive manufacturing patents, Stratasys has received more than 30 technology and leadership awards. For more information, visit or